Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.

Author

Tengku Elisa Bustaman

Date of Award

1-1-1999

Thesis Type

masters

Document Type

Thesis

Divisions

inst1

Department

Institut Pengajian Siswazah dan Penyelidikan, Universiti Malaya

Institution

University of Malaya

Note

Dissertation (M.Tech. (Material Sc.)) -- Institut Pengajian Siswazah dan Penyelidikan, Universiti Malaya, 2001.

Recommended Citation

Bustaman, Tengku Elisa, "Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman." (1999). Pre-2000 Student Works. 1757.
https://knova.um.edu.my/student_works_pre2000/1757