Date of Award
1-1-1999
Thesis Type
masters
Document Type
Thesis
Divisions
inst1
Department
Institut Pengajian Siswazah dan Penyelidikan, Universiti Malaya
Institution
University of Malaya
Note
Dissertation (M.Tech. (Material Sc.)) -- Institut Pengajian Siswazah dan Penyelidikan, Universiti Malaya, 2001.
Recommended Citation
Bustaman, Tengku Elisa, "Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman." (1999). Pre-2000 Student Works. 1757.
https://knova.um.edu.my/student_works_pre2000/1757
2859-ABSTRACT.pdf (270 kB)
2859-KANDUNGAN.pdf (395 kB)
2859-BAB_1.pdf (5817 kB)
2859-BAB_2.pdf (3616 kB)
2859-BAB_3.pdf (7761 kB)
2859-BAB_4.pdf (1495 kB)
2859-BAB_5.pdf (1359 kB)
2859-BIBLIOGRAFI.pdf (406 kB)
2859-LAMPIRAN.pdf (10997 kB)
2859-KANDUNGAN.pdf (395 kB)
2859-BAB_1.pdf (5817 kB)
2859-BAB_2.pdf (3616 kB)
2859-BAB_3.pdf (7761 kB)
2859-BAB_4.pdf (1495 kB)
2859-BAB_5.pdf (1359 kB)
2859-BIBLIOGRAFI.pdf (406 kB)
2859-LAMPIRAN.pdf (10997 kB)
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