Date of Award
1-1-2000
Thesis Type
Masters
Document Type
Thesis
Divisions
Faculty of Science
Department
-
Institution
Universiti Malaya
Abstract
This project studies the surface morphology of the copper deposit from three different bath solutions on polished copper (3.1 mm in diameter) electrode by using Scanning Electron Microscopy. The behaviour of glycine as an additive in a bath solution containing 0.3 M of copper (II) sulphate and 2.2 M of sulphuric acid was studied by using cyclic voltammetry. In this project, glycine did not involved directly in the reaction of CU²⁺/CU couple but increased the potential and current density of the plating process. However, glycine has the properties for inhibiting the deposition of copper onto the copper disc. Moreover, block growth and nodules growth is observed on the surface of the copper disc.
Additional Information
Dissertation (M.A) -- Faculty of Science, Universiti Malaya, 2000.
Recommended Citation
Ling, Jia Tsung, "Electrodeposition of copper on polished copper electrode" (2000). Student Works (2000-2009). 299.
https://knova.um.edu.my/student_works_2000s/299
Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial-No Derivative Works 4.0 International License.
Initial
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