Effect of porous copper pore density on joint interface: microstructure and mechanical analysis
Document Type
Article
Publication Date
1-1-2022
Abstract
The effect of the pore density of porous copper (Cu) on brazed Cu/porous Cu was investigated. A filler with a composition of Cu-9.0Sn-7.0Ni-6.0P (Sn: Tin; Ni: Nickel; P: Phosphorus) and porous Cu with pore densities of 15 pores per inch (PPI), 25 PPI, and 50 PPI were employed. The joint strength of Cu/porous Cu was evaluated with shear tests at different brazing temperatures. Characterizations of the joint interface and fractured surface were achieved with scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The micro-hardness test of Cu/porous Cu joint interface showed a high hardness value (HV) for 50 PPI porous Cu. This result was in line with its low shear strength. It was proved that the joint strength of Cu/porous Cu is dependent on the pore density of the porous Cu structure and brittle phases of Cu3P and Ni3P in the brazed interface. Copyright and License information: Journal of Harbin Institute of Technology (New Series) 2022
Keywords
Brazing, Interface microstructure, Porous metal, Shear fracture
Divisions
mechanical
Funders
FRGS University of Malaya [Grant No; FP062-2015A],Universiti Malaya [Grant No; ST006-2018]
Publication Title
Journal of Harbin Institute of Technology (New Series)
Volume
29
Issue
1
Publisher
Harbin Institute of Technology