Effect of porous copper pore density on joint interface: microstructure and mechanical analysis

Document Type

Article

Publication Date

1-1-2022

Abstract

The effect of the pore density of porous copper (Cu) on brazed Cu/porous Cu was investigated. A filler with a composition of Cu-9.0Sn-7.0Ni-6.0P (Sn: Tin; Ni: Nickel; P: Phosphorus) and porous Cu with pore densities of 15 pores per inch (PPI), 25 PPI, and 50 PPI were employed. The joint strength of Cu/porous Cu was evaluated with shear tests at different brazing temperatures. Characterizations of the joint interface and fractured surface were achieved with scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The micro-hardness test of Cu/porous Cu joint interface showed a high hardness value (HV) for 50 PPI porous Cu. This result was in line with its low shear strength. It was proved that the joint strength of Cu/porous Cu is dependent on the pore density of the porous Cu structure and brittle phases of Cu3P and Ni3P in the brazed interface. Copyright and License information: Journal of Harbin Institute of Technology (New Series) 2022

Keywords

Brazing, Interface microstructure, Porous metal, Shear fracture

Publication Title

Journal of Harbin Institute of Technology (New Series)

Divisions

mechanical

Funders

FRGS University of Malaya [Grant No; FP062-2015A],Universiti Malaya [Grant No; ST006-2018]

Volume

29

Issue

1

Publisher

Harbin Institute of Technology

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