Efficient thermal energy management of hollow pin fin heat sinks with and without phase change material
Document Type
Conference Item
Publication Date
12-1-2021
Abstract
Electronic devices need to be cooled efficiently. Phase change material (PCM) could be incorporated into a conventional fin heat sink (FHS) for such a purpose. This paper reports experimental results obtained on the thermal performances of four FHSs fabricated with different arrays and numbers of hollow aluminium pin fins with various lengths and diameters. Tests were conducted with and without filling them with PCM. Heat input was kept on for 2 hours and varied from 1W, 5W and 10W. Transient heating surface temperatures were recorded on a data logger and plotted every 5 minutes. The results showed that the PCM-filled FHS resulted in faster cooling rates and lower heating surface temperatures. Long and large diameter pins performed better than small and short pins. Efficient fin heat sinks for electronic cooling are essential in view of the weight and size of the component. Hence the findings of this paper would be beneficial for electronic cooling and useful to the electronic industry for efficient thermal energy management. © Published under licence by IOP Publishing Ltd.
Keywords
Efficient thermal energy management, Electronic cooling, Fin heat sink, Natural convection cooling, Phase change material (PCM)
Divisions
mechanical
Funders
None
Publication Title
IOP Conference Series: Earth and Environmental Science
Volume
945
Issue
1
Event Title
4th International Symposium on Green and Sustainable Technology, ISGST 2021
Event Location
Kampar
Event Dates
3 - 6 October 2021
Event Type
conference