Interfacial reaction on different solder composition after laser soldering
Document Type
Article
Publication Date
11-1-2024
Abstract
This study used electroless nickel-immersion gold surface finish. The lead free solder used are tin-silver-copper 305 and tin-silver-copper 307 solder alloys. The difference in copper composition will affect the intermetallic compound ` s microstructure after the laser soldering process. The intermetallic compound formation analysis reveals that only (Cu, Ni)6Sn5 was observed at the solder joint interface for both solders after laser soldering. The grain microstructure of tin-silver-copper 305 formed is rounded-shaped and bar-shaped, while tin-silver-copper 307 shapes are oval-shaped and flake-like. However, for cross-sectioned analysis, the intermetallic compound grain microstructure formed at the solder joint formation was (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 presented in dendrite-like and scale-like shapes. This result shows that copper content in solder composition is directly affected the intermetallic compound grain microstructure. When exposed to the ageing process, the intermetallic compound thickness will increase directly with ageing time. The intermetallic compound thickness for tin-silver-copper 305 was increased from 0.98 mu m to 8.34 mu m while tin-silver-copper 307 was increased from 1.54 mu m to 8.76 mu m. The result also shows that nano-sized of Ag3Sn grain particle was formed on the intermetallic compound surface after an ageing process for both samples, tin-silver-copper 305 and tin-silver-copper 307.
Keywords
ageing, electroless nickel, immersion gold, intermetallic compounds, laser soldering, lead-free solder, Alterung, bleifreies Lot, Chemisch Nickel, intermetallische Verbindungen, Laserstrahll & ouml, ten, Tauchgold
Divisions
fac_eng
Funders
Ministry of Higher Education Malaysia (MOHE) through Fundamental Research Grant Scheme ((FRGS/1/2019/TK03/UTHM/02/6)1),Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia
Publication Title
Materialwissenschaft und Werkstofftechnik
Volume
55
Issue
11
Publisher
Wiley-VCH Verlag
Publisher Location
POSTFACH 101161, 69451 WEINHEIM, GERMANY