Thermal and hydrodynamic management of a finned-microchannel heat sink applying artificial neural network
Document Type
Article
Publication Date
5-1-2023
Abstract
Thermal management of microelectronic circuits will be one of the most difficult challenges facing engineering processes in the near future. High operating temperatures in these devices can degrade the reliability of the components and reduce their life. Therefore, effective cooling technologies that can disperse the significant heat load from the surface of microelectronic equipment are required. An appropriate microchannel heat sink (MCHS) system with optimized geometry can be one of the reliable choices. In the current work, an artificial neural network (ANN) is exerted to optimize the geometry of a finned-MCHS. The distance of fins from the inlet in the second row (l), the distance of fins from the side walls in the first and third rows (t), and the angle of hexagons (theta) are the input parameters. According to the obtained results, the ANN model with a coefficient of determination of 0.999 performed well in predicting the Nusselt number (Nu) and pressure drop (Delta P). Among the investigated input parameters, the variations of the parameter of t affected the thermal and hydrodynamic properties of the device noticeably. Besides, the ANN model suggested that when the optimum values of input parameters (i.e., l = 7.636 mm, t = 4
Keywords
Annular microchannel heat sink, Relative efficiency index, Artificial neural network, Heat transfer management, Fin geometry
Divisions
sch_ecs
Funders
King Faisal University King Saud University (R.G.P.2/156/44),Al-Mustaqbal University College (MUC - E-0122)
Publication Title
Case Studies in Thermal Engineering
Volume
45
Publisher
Elsevier
Publisher Location
RADARWEG 29, 1043 NX AMSTERDAM, NETHERLANDS