Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix
Document Type
Article
Publication Date
9-1-2022
Abstract
Microstructure of the eutectic region and beta-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and beta-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of beta-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of beta-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint.
Keywords
Lead-free solder, SN-AG-CU, Interfacial intermetallic compounds
Divisions
fac_eng
Funders
Universiti Malaya,Malaysian Ministry of Higher Education, Malaysia [D000026-16001]
Publication Title
Journal of Materials Science: Materials in Electronics
Volume
33
Issue
25
Publisher
Springer
Publisher Location
VAN GODEWIJCKSTRAAT 30, 3311 GZ DORDRECHT, NETHERLANDS