Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix

Document Type

Article

Publication Date

9-1-2022

Abstract

Microstructure of the eutectic region and beta-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and beta-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of beta-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of beta-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint.

Keywords

Lead-free solder, SN-AG-CU, Interfacial intermetallic compounds

Publication Title

Journal of Materials Science: Materials in Electronics

Divisions

fac_eng

Funders

Universiti Malaya,Malaysian Ministry of Higher Education, Malaysia [D000026-16001]

Volume

33

Issue

25

Publisher

Springer

Publisher Location

VAN GODEWIJCKSTRAAT 30, 3311 GZ DORDRECHT, NETHERLANDS

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