Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
Document Type
Article
Publication Date
1-1-2020
Abstract
This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves simultaneous application of laser heat and ultrasonic pressure. The beneficial effects of laser heating are apparent to overcoming the processing challenges associated with high hardness of copper. The application of laser yields columnar gains and grain size gradient. The laser-assisted samples have undergone a different deformation mechanism which is indicated by the non-localized nature of deformation. The dynamic thermal restorations in the laser-assisted sample are obvious. © 2019 Elsevier B.V.
Keywords
FAB bonding, EBSD, TKD, Laser treatment, Gold, Copper
Divisions
fac_eng
Publication Title
Materials Letters
Volume
259
Publisher
Elsevier