Corrosion insight of iron and bismuth added Sn–1Ag–0.5Cu lead-free solder alloy
Document Type
Article
Publication Date
1-1-2020
Abstract
The present study attempted to assess the corrosion performance of iron (Fe) and bismuth (Bi) added Sn–1Ag–0.5Cu (SAC105) lead-free solder alloy in NaCl-based solutions. Potentiodynamic polarisation measurements indicated that in acidic or alkaline solutions, corrosion potential (Ecorr) shifted to more negative (active) values and the corrosion current density (icorr) visibly increased. In a neutral pH solution, SAC105 solder alloys exhibited notable corrosion resistance owing to the stability of passive film formed on the surface of solder alloys. Potentiodynamic polarisation curves also showed that the addition of 0.05 wt% Fe and 1 wt% Bi improved the corrosion rate of SAC105 and lowered the Ecorr towards more noble value due to the reduced micro-galvanic interaction between the cathodic Ag3Sn IMCs and the anodic Sn matrix. Immersion tests revealed that the mass loss increased in the order: SAC105–Fe–2Bi > SAC105 > SAC105–Fe–1Bi. © 2019, © 2019 Institute of Materials, Minerals and Mining Published by Taylor & Francis on behalf of the Institute.
Keywords
Sn–1Ag–0.5Cu, pH effect, Fe/Bi addition, microstructural features, corrosion behaviour
Divisions
fac_eng,CHEMISTRY
Funders
University of Malaya Research Grant (grant number of RP032C-15AET),Fundamental Research Grant Scheme (grant number of FP055-2015A)
Publication Title
Corrosion Engineering, Science and Technology
Volume
55
Issue
1
Publisher
Taylor & Francis