Performances and procedures modules in micro electro mechanical system packaging technologies
Document Type
Article
Publication Date
1-1-2018
Abstract
This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS technology applications in general domains are automotive, consumer, industrial, biotechnology and commercial applications. Few methods such as the low power oven, vacuum, and silicon glass packages were discussed. The major technique as die level and wafer level of packing including thin-film packing were reviewed in this paper. The problem of several failure mechanisms and challenges and their solutions were discussed in this review.
Keywords
Micro electro mechanical system (MEMS), Die-level packaging, Thin-film packing, Vacuum package
Divisions
photonics
Publication Title
Results in Physics
Volume
11
Publisher
Elsevier