Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
Document Type
Article
Publication Date
1-1-2018
Abstract
The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups.
Keywords
Aromatic functional groups, Comparative studies, Interfacial interaction, No-clean fluxes, Printed circuit boards (PCB), Sn-3.0Ag-0.5Cu, Sn-Ag-Cu lead-free solders, Stencil printing
Funders
Ministry of Higher Education of Malaysia through My Brain 15 PHD scholarship programme,Universiti Kebangsaan Malaysia (UKM) for research grants GGPM-2017-048 and DPP-2015-042
Publication Title
Journal of Materials Science: Materials in Electronics
Volume
29
Issue
15
Publisher
Springer