Comparison studies on the anticorrosion and overall performance of solvent/water based poxy-copper reinforced composite coatings
Document Type
Article
Publication Date
1-1-2016
Abstract
The influence of using two types of carrier agent namely, water and solvent, on the overall performance of epoxy resin has been investigated. Furthermore, four different loading rates of copper pigments (Cu) have been successfully embedded into two developed polymeric matrices and the changes occurred in the structure, thermal, fouling ability, morphology, and the anticorrosion performance have been studied. Fourier transform infrared spectroscopy (FTIR), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), field immersion test, scanning electron microscope (SEM), and electrochemical impedance spectroscopy (EIS) were used to evaluate the formulated coating systems. The results revealed that, the incorporation of Cu pigments did not significantly affect the efficiency of the room temperature curing process and further led to enhancement on the thermal stability of both developed epoxy resins. However, utilizing Cu pigments with solvent based epoxy (SB) showed better antifouling and anticorrosion properties compered to Cu composites prepared with water based epoxy resin (WB). The electrochemical behavior up to 30 days of immersion in 3.5% NaCl solution confirmed that the SB resin loaded with Cu pigments at 10% PVC, SB 10, demonstrated excellent barrier and anticorrosion properties. Neat WB coating (WB 0) was found to have the best performance among all WB coating systems.
Keywords
Antifouling coatings, Copper composites, EIS, Epoxy resins, Mild steel, SEM, Water base coatings
Divisions
PHYSICS
Funders
University of Malaya: Research grants RP025C-14AFR and PG001- 2016A,Ministry of Education, Malaysia: High Impact Research Grant (H-21001 F000046)
Publication Title
Materials Express
Volume
6
Issue
5
Publisher
American Scientific Publishers