Document Type
Article
Publication Date
2-15-2015
Abstract
The present study focuses on coarsening of Ag3Sn intermetallic compound in the Sn-1Ag-0.5Cu and Fe-modified Sn-1Ag-0.5Cu solder alloy. The investigations showed that the Ag3Sn intermetallics coarsened rapidly in the Sn-1Ag-0.5Cu solder alloy whereas the Ag3Sn intermetallics were found to be quite stable in the Fe-modified Sn-1Ag-0.5Cu solder alloy. The lattice strain in the Ag3Sn intermetallics and the blocking effect on Ag diffusivity in Sn matrix suggested the possible mechanisms for the coarsening suppression of the Ag3Sn intermetallics in the Fe-modified solder alloy. (C) 2014 Elsevier B.V. All rights reserved.
Keywords
ag3sn intermetallics, coarsening, fe addition, lead-free solder, mechanical-properties, tensile properties, microstructural evolution, snagcu solder, 2 wt.percent, sn, cu, joints, interfaces
Divisions
fac_eng
Funders
HIR-MOHE research grant UM.C/HIR/MOHE/ENG/29 ,UMRG RP003A/13AET RP003B/13AET RP006A-13AET
Publication Title
Journal of Alloys and Compounds
Volume
622
Additional Information
Au6ze Times Cited:0 Cited References Count:28