The effects of adding silver and indium to lead-free solders
Document Type
Article
Publication Date
1-1-2009
Keywords
Cu reliability joints
Publication Title
Welding Journal
ISSN
0043-2296
Recommended Citation
Dharma, I.G.B.; Abd Shukor, Mohd Hamdi; and Ariga, T., "The effects of adding silver and indium to lead-free solders" (2009). Research Publications (2006 to 2010). 2172.
https://knova.um.edu.my/research_publications_2006_2010/2172
Divisions
fac_eng
Volume
88
Issue
4
Additional Information
You can e-mail to me for the full text of my jurnal at hamdi@um.edu.my
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