The effects of adding silver and indium to lead-free solders

Authors

• I.G.B. Dharma
• Mohd Hamdi Abd ShukorFollow
• T. Ariga

Document Type

Article

Publication Date

1-1-2009

Keywords

Cu reliability joints

Publication Title

Welding Journal

ISSN

0043-2296

Recommended Citation

Dharma, I.G.B.; Abd Shukor, Mohd Hamdi; and Ariga, T., "The effects of adding silver and indium to lead-free solders" (2009). Research Publications (2006 to 2010). 2172.
https://knova.um.edu.my/research_publications_2006_2010/2172

Divisions

fac_eng

Volume

88

Issue

4

Additional Information

You can e-mail to me for the full text of my jurnal at [email protected]