Date of Award
1-1-2000
Thesis Type
Masters
Document Type
Thesis
Divisions
Faculty of Business and Economics
Department
-
Institution
Universiti Malaya
Abstract
Despite advances in integrated circuits (IC) equipment and fabrication techniques, there still exist random fluctuations or statistical disturbances in any IC manufacturing facility. which can adversely affect the production yield. Actually devices and circuits are being designed with increasingly tighter parameter and performance margins. As a result, chip performance becomes even more sensitive to the statistical variations, and this may result in low production yield. One of the significant detractors of cost in a manufacturing line is yield loss due to contamination and the time required to increase the yield to profitable levels. Yield loss in a manufacturing line is determined by the various attributes of fabrication, product testing and failure analysis. This research attempts to determine whether there are any significant differences in the average yield by tester, by day and by test insert at each different level of temperature i.e. TOS, TLO and THI test insert. This paper also attempts to examine the yield across the various tests and investigated the major defect type that contributed to yield loss.
Additional Information
Dissertation (M.A) -- Faculty of Business and Economics, Universiti Malaya, 2000
Recommended Citation
Kam, Choy Sar, "Analysing random access memory chip yield performance" (2000). Student Works (2000-2009). 261.
https://knova.um.edu.my/student_works_2000s/261
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